HRMQP30185M24
The RINDO HR series products have a z-axis repeatability of up to 50nm, a frame rate of up to 228FPS, 65 million points of cloud data, a Sharm projectiondesign, and a high depth of field, effectively solving the problems of high reflectivity and shadow obstruction. They are widely used in high-precision inspection scenarios such as semiconductor wafers, chips, and SMT.
Features
  • Projection design based on Scheimpflug principle, ultra-high depth of field
  • Effectively solve high reflection, shadow and occlusion problems
  • Widely used in high-precision inspection scenarios such as wafers, chips, and SMT
Specifications
  • Working Distance(mm)
    158
    Depth of Field(mm)
    7
  • FOV(mm)
    50.5*43.8
    DLP
    1280×720
  • CMOS Resolution
    24M
    Repeatability 3
    3um
  • Frame Rate
    ≤2.9FPS
    Light Source
    459nm
  • Input Voltage
    12V(10A)

                  

Dimensions

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