HRMBP47180M20
The RINDO HR series products have a z-axis repeatability of up to 50nm, a frame rate of up to 228FPS, 65 million points of cloud data, a Sharm projectiondesign, and a high depth of field, effectively solving the problems of high reflectivity and shadow obstruction. They are widely used in high-precision inspection scenarios such as semiconductor wafers, chips, and SMT.
Features
- Projection design based on Scheimpflug principle, ultra-high depth of field
- Effectively solve high reflection, shadow and occlusion problems
- Widely used in high-precision inspection scenarios such as wafers, chips, and SMT
Specifications
- Working Distance（mm)
- 158
- Depth of Field（mm)
- 10
- FOV（mm）
- 135.2×77.1
- DLP
- 36.2×36.2
- CMOS Resolution
- 20M
- Repeatability 3
- 3um
- Frame Rate
- ≤4.2FPS
- Light Source
- 459nm
- Input Voltage
- 12V（10A）
Recommended Series
- CONTACT INFORMATION
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Address: 6 / F, Jingdong Technology Building, 76 Zhichun Road, Haidian District, Beijing
Telephone: 010-64754979
- Sales Consulting
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E-Mail: sales@bopixel.com
Telephone: 139 1010 6272 Mr. Wang
- Technical Support
- E-Mail: support@bopixel.com
- PRODUCTS
- Structured Light 3D Camera
- High Speed Area Scan Camera
- HIGH SPEED LINE SCAN CAMERA
- DLP Projector
- Cr Series Code Reader & Industrial Smart Camera
- Ultra-high speed camera
- Line Laser 3D Profiler
- Frame Grabber
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